GPU Packaging Substrate Supply Tight Until 2028
tengyanAI · x · 2026-07-19
FC-BGA packaging substrates are sold out through **H2 2028**, and each new GPU generation requires more substrates. - **Blackwell** needs over **2x** the substrate area of Hopper. - **Rubin** adds another **75%** on top. - Taiwan's three major suppliers **Unimicron / Kinsus / Nan Ya PCB** are at full capacity. - Upstream material **Ajinomoto build-up film** holds >**95%** market share, recently raised prices by **30%**. Key takeaway: AI GPU supply bottlenecks are shifting from chips to packaging and materials.
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