GPU Packaging Substrate Supply Tight Until 2028
tengyanAI · x · 2026-07-19
FC-BGA packaging substrates are sold out through H2 2028, and each new GPU generation requires more substrates.
- Blackwell needs over 2x the substrate area of Hopper.
- Rubin adds another 75% on top.
- Taiwan's three major suppliers Unimicron / Kinsus / Nan Ya PCB are at full capacity.
- Upstream material Ajinomoto build-up film holds >95% market share, recently raised prices by 30%.
Key takeaway: AI GPU supply bottlenecks are shifting from chips to packaging and materials.
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