The Hardware Reality of 400G Interconnects
jwt0625 · x · 2026-07-15
This post summarizes a technical discussion on the feasibility of 400G interconnects/packaging, pointing to a complete high-speed signal chain including Broadcom PHY, CoWoS packaging, microbump, Ajinomoto substrate, BGA, via, and Samtec/Amphenol connectors.
Replies use highly exaggerated, poetic language to describe how "bits" travel through these hardware layers. The core message is that the practical deployment of high-speed links like 400G depends on whether the entire packaging, substrate, interconnect, and connector design can handle the physical stress.
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