Opinion: CXMT Hybrid Bonding is Unoriginal but Yields 15%-25% Gains
zephyr_z9 · x · 2026-07-05
Commenting on recent news about CXMT, X user @zephyrz9 noted that fabricating peripheral circuits (peri) and memory cell arrays on separate wafers before combining them via hybrid bonding is already a shared roadmap among manufacturers. While CXMT's move isn't particularly novel, it remains a smart strategy capable of delivering a 15%–25% performance boost.
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