SK Hynix Breaks Ground on US HBM Packaging Plant

SK hynix has begun construction of its $4 billion advanced packaging plant in Indiana, targeting 2028 production and HBM4e mass production by Q3 2029, though cutting-edge wafers will still be made in Korea.

2026-08-31 ~ 2026-08-31 · 2 related posts

• SK Hynix breaks ground on Indiana HBM plant, targeting HBM4e mass production in 2029 — Beth_Kindig · 2026-08-31
• SK hynix Builds in Indiana: HBM Supply Chain Shifts to Selective Localization — pstAsiatech · 2026-08-31